Our PCB assembly line utilizes SMD technology to produce advanced PCB assemblies, meeting the demanding requirements of aircraft, missile, and space electronic systems with exceptional precision.
Miltech’s assembly line equipment
- Jet Printer: Capable of jetting over one million dots per hour with single dot accuracy of ±40 µm (Cpk=1.0), providing precise solder paste deposits.
- SPI: High-speed 3D inspection ensures timely verification of solder paste deposits and provides precise measurements of solder paste volume and shape, ensuring consistent quality.
- Pick & Place: Rated at 40,000 components per hour (CPH) with accuracy of ±50 µm, optimizing assembly time and supporting components from 01005 chips to large connectors, enhancing versatility.
- Vapor Phase: Achieves void rates below 1% with the optional vacuum module, ensuring high-quality solder joints and without the risk of cross contamination.
- AOI: Delivers rapid inspection of solder joints and component placements, maintaining production flow. Utilizes advanced algorithms to identify defects, ensuring product reliability.
- AXI: Designed for high-speed inline inspection, suitable for high-volume production. Combines 2D, 2.5D, and 3D imaging for comprehensive analysis.
- Selective soldering
- SMT rework
- Coating